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April 1997

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Subject:
Via in Pad
From:
Fred Pescitelli <[log in to unmask]>
Date:
Thu, 10 Apr 1997 09:09:32 -0400
Content-Type:
text/plain
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All,
I am designing a board that is about 100% package density. It is a
combination Digital and Analog design. It will be reflow top side only.
Most of the parts are small and do not have room under them for via's. Has
anybody used the Via in Pad technology? What has been you experience with
it? I realize that the Vias will tend to thieve the solder during reflow,
and cause problems.
Regards,
Fred Pescitelli
Phoenix Designs
1285 Turner Rd.
Lilburn, GA 30247
V-770-923-3465
F-770-923-2272
[log in to unmask]

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