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March 1997

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From [log in to unmask] Mon Mar 17 15:
59:43 1997
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Subject:
DesignRules Wire and Ribbon Bonding
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TEXT/PLAIN (24 lines) 
We are developping a designrulebook for design for manufacturing of
Au Thin Wire Wedge/Wedge  and Ribbon Bonding especially for High Frequency 
Applications.
Is there anyone,  who knows  designrules for DFM for  similar or  other 
wire/ribbon bond applications. May be that there still exists a structure for such a Designrulebook.

I think it makes sense to work together in a userforum  on this matter.

Thank Yoe very much

M. Jeremias

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