We are developping a designrulebook for design for manufacturing of Au Thin Wire Wedge/Wedge and Ribbon Bonding especially for High Frequency Applications. Is there anyone, who knows designrules for DFM for similar or other wire/ribbon bond applications. May be that there still exists a structure for such a Designrulebook. I think it makes sense to work together in a userforum on this matter. Thank Yoe very much M. Jeremias *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************