Subject: | |
From: | |
Reply To: | |
Date: | Mon, 03 Mar 1997 15:19:15 +0000 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
subject: pretreatment of innerlayers
to improve yields in innerlayers production, we are considering the use
of chemical cleanning instead of pumicebrush prior to lamination of
photoresist.
there is a new trend towards using chemical cleaning only to remove
passivation (e.g. chromate) and impurities like organics, oxides etc.
this should be achieved by a hot alkaline spray cleaner followed by a
ordinary acidic spray cleaner.
we are using FR4-copperclad, thickness 0,10 to 0,70 mm, copperfoil; 12
to 70 µm. the thickness of the passivationlayer is 7,0 nm (0,007 µm).
If you have had used/or are using this new principle of pretreatment of
innerlayers, we would like to hear what was/ is your experience with the
process.
best regards
peer fisker
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|