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40:32 1997 |
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subject: pretreatment of innerlayers
to improve yields in innerlayers production, we are considering the use
of chemical cleanning instead of pumicebrush prior to lamination of
photoresist.
there is a new trend towards using chemical cleaning only to remove
passivation (e.g. chromate) and impurities like organics, oxides etc.
this should be achieved by a hot alkaline spray cleaner followed by a
ordinary acidic spray cleaner.
we are using FR4-copperclad, thickness 0,10 to 0,70 mm, copperfoil; 12
to 70 µm. the thickness of the passivationlayer is 7,0 nm (0,007 µm).
If you have had used/or are using this new principle of pretreatment of
innerlayers, we would like to hear what was/ is your experience with the
process.
best regards
peer fisker
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