We are about to embark on using microvia or sequential build-up technology
to put small vias in the surface mount pads on our boards. Part of our
qualification process entails understanding the reworkability of the boards
which contain Dycostrate/PERL technology. We have detected pad lifting
after 3 rework cycles, however the lifting is not so substantial as to
require re-epoxying. The pad would likely be trimmed and replaced. Has
anyone out there established guidelines for the extent of pad lifting
before relabiltiy and/or quality is impacted? Is anyone else experiencing
pad lifting with these technologies.? Thanks in advance.
Jenni Marcy
Sr. Sourcing Engineer
Storage Technology Corp.
Louisville, Colorado
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************