Text:   
Date:   5/2/97 14:04

Msg From: TECHNET

Dear Jim,
We would be interested in doing the beta testing for this
technology.If you would like to proceed with beta testing at our
facility in India,you can get in touch with me.
Thanks
Atul Rastogi
Altos India Ltd
Fax:(91)124-340842
    (91)124-342892
Phone:(91)124-342894
EMail:[log in to unmask]
>>>>>>>>>>>>>>>

Posted: Fri, Jan 31, 1997   7:09 AM                  Msg:
UJJH-2847-2090/20
From:   ("RFC-822": <TechNet-request(a)ipc.ipc.org>, SITE:INTERNET)
To:     ("RFC-822": <technet(a)ipc.org>,SITE:INTERNET)
CC:     HNA.BLR/SMY,
        AIL.EHTP/PCL
Subj:   Re: Mixed Tech Assy

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Teka Interconnection Systems (a connector mfg) is in the final
development
stage of a product that could eliminate secondary soldering processes
such
as wave soldering for certain mixed tech board assy's and allow for
inline
reflow without additional solder paste or flux.

We are looking for interested parties with forced convection ovens
with whom
we could do beta testing. Interested parties please respond to:

Jim Zanolli
Teka Interconnection Systems
phone: 401-785-4110
fax: 401-781-5730
Best Regards
Jim Zanolli

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