Mason,

The 35/35, 35/25 & 25/25 are the most common C-stage/B-stage resin
coated coppers.  35, 50,80 & 100 micron B-stage only coated coppers are
also readily available.  We do not currently have a 0.25 ounce resin
coated copper product but do supply 12 micron (3/8ths oz.) resin coated
on a VLP (very low profile) copper which exhibits excellent etch factors
and increased etch rates.  This product carries about a 25% premium over
the above listed 18 micron products which are coated on low profile
copper.

Kevin Thomas
AlliedSignal Laminate Systems
 ----------
>>>From: mhu
>>>To: [log in to unmask]
>>>Subject: Re[2]: FAB:Laser vias
>>>Date: Wednesday, February 19, 1997 10:05AM
>>>
>>>
>>>Kevin,
>>>
>>>I thought 35/35 and 35/25 are the "standard" resin thickness.  Do you also
>>>supply 50/50 or 35/50 regularly?  BTW, is 0.25 oz. copper avaiable without
>>>significant price increase?
>>>
>>>Mason Hu
>>>Zycon Corporation
>>>
>>>______________________________ Reply Separator
>>>_________________________________
>>>Subject: RE: FAB:Laser vias
>>>Author:  [log in to unmask] at corp
>>>Date:    2/19/97 3:53 AM
>>>
>>>
>>>David - Independent of  whether the resin coated copper is B-stage only
>>>or C-stage/B-stage, you are correct to assume that in order to
>>>encapsulate the innerlayer circuitry - if it's one ounce (35 micron)
>>>copper - you should have two mils (50 microns) of resin.  Less resin is
>>>necessary to cover one-half ounce (18 micron) circuitry.  Several
>>>different thicknesses from 35 microns to 100 microns are currently
>>>commercially  available of both  B-stage only or C-stage/B-stage
>>>materials.
>>>
>>>Kevin R. Thomas
>>>MicroVia Materials Product Manager
>>>AlliedSignal Laminate Systems
>>>608.791.2288
>>> ----------
>>>>>>From: David Arivett
>>>>>>To: [log in to unmask]
>>>>>>Subject: FAB:Laser vias
>>>>>>Date: Saturday, February 15, 1997 12:54PM
>>>>>>
>>>>>>
>>>>>>
>>>>>>
>>>>>>  An article in the February edition of PCFAB talks about laser drilled
>>>>>>micro-vias. It shows a multi-layer stack-up of two cores with pre preg 
>>>in
>>>>>>the center. The outer layers are formed with resin coated foil. My
>>>question
>>>>>>is: how thick is the resin on the foil? I am sure it must be at least 2
>>>>>>mils
>>>>>>in order to have enough resin to encapsulate the inner layer circuitry.
>>>>>>What
>>>>>>is the maximum it might be?
>>>>>>
>>>>>>David Arivett
>>>>>>Cuplex Inc.
>>>>>>
>>>>>>************************************************************************
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