Mason, The 35/35, 35/25 & 25/25 are the most common C-stage/B-stage resin coated coppers. 35, 50,80 & 100 micron B-stage only coated coppers are also readily available. We do not currently have a 0.25 ounce resin coated copper product but do supply 12 micron (3/8ths oz.) resin coated on a VLP (very low profile) copper which exhibits excellent etch factors and increased etch rates. This product carries about a 25% premium over the above listed 18 micron products which are coated on low profile copper. Kevin Thomas AlliedSignal Laminate Systems ---------- >>>From: mhu >>>To: [log in to unmask] >>>Subject: Re[2]: FAB:Laser vias >>>Date: Wednesday, February 19, 1997 10:05AM >>> >>> >>>Kevin, >>> >>>I thought 35/35 and 35/25 are the "standard" resin thickness. Do you also >>>supply 50/50 or 35/50 regularly? BTW, is 0.25 oz. copper avaiable without >>>significant price increase? >>> >>>Mason Hu >>>Zycon Corporation >>> >>>______________________________ Reply Separator >>>_________________________________ >>>Subject: RE: FAB:Laser vias >>>Author: [log in to unmask] at corp >>>Date: 2/19/97 3:53 AM >>> >>> >>>David - Independent of whether the resin coated copper is B-stage only >>>or C-stage/B-stage, you are correct to assume that in order to >>>encapsulate the innerlayer circuitry - if it's one ounce (35 micron) >>>copper - you should have two mils (50 microns) of resin. Less resin is >>>necessary to cover one-half ounce (18 micron) circuitry. Several >>>different thicknesses from 35 microns to 100 microns are currently >>>commercially available of both B-stage only or C-stage/B-stage >>>materials. >>> >>>Kevin R. Thomas >>>MicroVia Materials Product Manager >>>AlliedSignal Laminate Systems >>>608.791.2288 >>> ---------- >>>>>>From: David Arivett >>>>>>To: [log in to unmask] >>>>>>Subject: FAB:Laser vias >>>>>>Date: Saturday, February 15, 1997 12:54PM >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> An article in the February edition of PCFAB talks about laser drilled >>>>>>micro-vias. It shows a multi-layer stack-up of two cores with pre preg >>>in >>>>>>the center. The outer layers are formed with resin coated foil. My >>>question >>>>>>is: how thick is the resin on the foil? I am sure it must be at least 2 >>>>>>mils >>>>>>in order to have enough resin to encapsulate the inner layer circuitry. >>>>>>What >>>>>>is the maximum it might be? >>>>>> >>>>>>David Arivett >>>>>>Cuplex Inc. >>>>>> >>>>>>************************************************************************ * >>>** >>>>>>* TechNet mail list is provided as a service by IPC using SmartList >>>v3.05 * >>>>>>************************************************************************ * >>>** >>>>>>* To subscribe/unsubscribe send a message <to: [log in to unmask]> >>> * >>>>>>* with <subject: subscribe/unsubscribe> and no text in the body. >>> * >>>>>>************************************************************************ * >>>** >>>>>>* If you are having a problem with the IPC TechNet forum please contact >>> * >>>>>>* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] >>> * >>>>>>************************************************************************ * >>>** >>>>>> >>>>>> >>> >>>*************************************************************************** >>> >>>* TechNet mail list is provided as a service by IPC using SmartList v3.05 * >>> >>>*************************************************************************** >>> >>>* To subscribe/unsubscribe send a message <to: [log in to unmask]> * >>> >>>* with <subject: subscribe/unsubscribe> and no text in the body. * >>> >>>*************************************************************************** >>> >>>* If you are having a problem with the IPC TechNet forum please contact * >>> >>>* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * >>> >>>*************************************************************************** >>> >>> >>>*************************************************************************** >>>* TechNet mail list is provided as a service by IPC using SmartList v3.05 * >>>*************************************************************************** >>>* To subscribe/unsubscribe send a message <to: [log in to unmask]> * >>>* with <subject: subscribe/unsubscribe> and no text in the body. * >>>*************************************************************************** >>>* If you are having a problem with the IPC TechNet forum please contact * >>>* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * >>>*************************************************************************** >>> >>> *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************