Hi all,

Anybody that have experience from wave soldering of 12 layer boards, six 
power and ground planes, thickness of 2,3 mm populated with through hole 
connectors and ceramic pin grid arrays. 
I know there is a pin-hole relationship but does the thickness also come in 
as a parameter? Can it be critical with temperature so I achieve reflow of 
solder joint on the component side and or destroy the board?

Thanks for your comments

Hans Bogren
Ericsson Telecom




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