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Date: | Thu, 13 Feb 97 18:52:41 PST |
Content-Type: | text/plain |
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Hi all,
Anybody that have experience from wave soldering of 12 layer boards, six
power and ground planes, thickness of 2,3 mm populated with through hole
connectors and ceramic pin grid arrays.
I know there is a pin-hole relationship but does the thickness also come in
as a parameter? Can it be critical with temperature so I achieve reflow of
solder joint on the component side and or destroy the board?
Thanks for your comments
Hans Bogren
Ericsson Telecom
)
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