In response to Mr. Lang's request below, information regarding COB, TAB,
CSP and other advanced packaging methodologies is readily available in
periodicals such as;

1)Advanced Packaging
2)Electronic Packaging and Production
3)Circuits Assembly
4)SMT
5)Printed Circuit Fabrication
6)CircuiTree

I addition, the proceedings of NEPCON, SMI, IPC Expo, etc. have many
good articles.

Other good sources of information are the industry consortia such as
ITRI, NEMI, NCMS, DARPA, as well as IPC of course.

Any discussion of equipment and service providers would require
considerable discussion to qualify the application and supplier
capabilites.  Anyone interested in a more detailed discussion in these
areas can contact me directly.

Phil Yates
V.P. Advanced Assembly Technology
Nextek, Inc.
(205) 881 6030
(205) 882-6031 fax
****************************
Lang, Michael wrote:
> 
> I am looking for sources of information regarding the use of COB and TAB.  I
> am in the investigative phase of an IRAD project.  Any information regarding
> equipment suppliers, full service suppliers, etc would be useful.
> 
> As I begin this investigation, I am quickly leaning towards including Chip
> Scale Packaging.  The January 1997 Electronic Packaging and Production had a
> very good article on this.  Since CSP is defined in J-STD-012 as "no larger
> than 1.2x larger than the die" it seems like it may be the best alternative
> (much more conventional processing).
> 
> Does anyone know the availability of CSP (now and near future?)
> 
> I am looking into who might repackage die into this form on a custom basis.
>  I'll share that information with the group.
> 
> Thanks,
> 
> Michael Lang
> [log in to unmask]
> 
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