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| From [log in to unmask] Mon Feb 10 17: |
23:41 1997 |
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Mr. Stewart,
A available method of describing the structure of build-up/micro-via
technology boards is;
A/B/C
where;
A = Number of build-up circuit layers on the top of the assembly
B = Number of circuit (or power/ground) layers on the internal
standard drilled core
C = Number of build-up circuit layers on the bottom of the
assembly
i.e. a 2/4/2 assembly would have 2 layers of build up technology
laminated on each side of a standard 2 layer core.
Phil Yates,
Nextek, Inc.
***********************************
[log in to unmask] wrote:
>
> \0
> TO: I4235700 IBMMAIL new address for ipc technet 25.6.96
>
> FROM: DSTEWART EX2 D.Stewart - Product Development Manager.
>
> DATE: 6 February 1997
> SUBJECT: High Density Interconnect
> REFERENCE: definition?
>
> I have been having discussions with customers about how many
> distribution / high density interconnect layers etc are possible
> with the new microvia technologies, and we suddenly realised that
> some of the time we were talking cross purposes, because nobody has
> really defined what is a high density interconnect/distribution
> layer. If someone quotes 3 layers of HDI, does this mean 2
> dielectric seperations with vias linking, or 3 dielectrics?
> With our laser process linking layer 1-2, I would suggest that this
> gives 2 layers of HDI or distribution, as the high density is
> achieved by reducing via pad sizes down to 10 mil or less.
> Any views or definitions on this?
>
> Dougal Stewart
> Product DEvelopment manager
> Exacta Circuits
> Scotland
>
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