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| From [log in to unmask] Mon Feb 10 12: |
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\0
TO: I4235700 IBMMAIL new address for ipc technet 25.6.96
FROM: DSTEWART EX2 D.Stewart - Product Development Manager.
DATE: 6 February 1997
SUBJECT: High Density Interconnect
REFERENCE: definition?
I have been having discussions with customers about how many
distribution / high density interconnect layers etc are possible
with the new microvia technologies, and we suddenly realised that
some of the time we were talking cross purposes, because nobody has
really defined what is a high density interconnect/distribution
layer. If someone quotes 3 layers of HDI, does this mean 2
dielectric seperations with vias linking, or 3 dielectrics?
With our laser process linking layer 1-2, I would suggest that this
gives 2 layers of HDI or distribution, as the high density is
achieved by reducing via pad sizes down to 10 mil or less.
Any views or definitions on this?
Dougal Stewart
Product DEvelopment manager
Exacta Circuits
Scotland
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