TO HAWK CHEN
          Hawk, I've seen this problem before and found that the gold 
          bath had a lower gold content which caused more hydrogen 
          gassing and made the plating more inefficient.  This 
          loosened the soldermask at the gold tab interface.  The 
          addition of gold improved the situation.
          
          Another thing which greatly improved all soldermask peel was 
          changing from a chemical preclean to a pumice scrub 
          preclean.  This was especially true when trying to avoid 
          soldermask peel in electroless nickel/immersion gold 
          processing.
          
          Dave Sullivan
          Rockwell Collins, Inc.
          
          [log in to unmask]


______________________________ Reply Separator _________________________________
Subject: Solder Mask Peel Off
Author:  [log in to unmask] at ccmgw1
Date:    1/3/97 9:35 PM


Friends:
          
  We encounter a problem with solder mask peel off which is near gold
finger, while after gold plated.
  Is there anybody experience to this problem solution ?
Our solder mask in use is "Tamura" & "Taiyo". Gold plating tank is deep 
type.
          
Thanks and Best Regards,
          
Gloria Electronics, Taiwan
R & D Chief
Hawk Chen
          
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