Brett,
   Although dishdowns are hard to detect on an AOI there should be a 
relationship to random opens. One root cause of this type of defect would 
be pits, dents, and depressions in the laminate. This can be caused by 
particles coming in contact between the lamination planishing plate and 
copper foil. Also look at epoxy dust. Epoxy dust usually will cause 
unetched copper because it acts as an etch resist but sometimes it lands 
perfectly on a circuit line and will cause a severe depression in the 
laminate. The bottom line is check the cleansliness of your lamination 
operation and consider a sampleing plan of incoming laminate material.

Jeff Worth
New Products

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************