Good Morning,

      Recently  a customer had a field failure in which and internal circuit
trace
burned through. After a failure analysis was done, a cross-section determined
that at the point of failure there was a dish-down or vertical thinning of
the trace.

     This defect was not picked up at innerlayer inspection as the primary
focus
is on shorts, breaks and mouse-bites. The customer would like to know if
there
is any industry data showing the possible frequency of such a defect.

    How do I give a cause/corrective action for a defect Im not sure I can
consistantly 
detect?

Thank you for your help.

Brett Austin
Nationwide Circuits Inc

   


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