Chuck: You're right MX is hard to strip.We looked at it for both deep	
		gold and acid Cu pattern plate.It's a great plating resist,it 
		has minimal lifting,good line resolution and edge definition;	
		maybe a little on the brittle side.			
		It definetly does not strip as fast as other dryfilm resists	
		we have used.We had to reduce the stripper conveyor speed by	
		50% and in some cases reuired a double pass on product with	
		tighter spacing to assure complete stripping.		
		In our case we were laminating it to els.Cu/antitarnish	and	
	       also to els.Cu/scrub with similar photo processing and hold	
		times to yours.The stripper chemistry was a monoethanolamine	
		based Dexter product 12-13%bv,120-125F.			
		We found increasing chemical concentration of the stripper	
		gave very little improvement,raising the temp helped a little	
		bit more but nothing dramatic.However be careful this can    
                also start to cause problems in your resist particulate fil-	
		tation system.						
		The shorter the time between lamination and strip the better,	
		also any pre-bake prior to plate locks the resist into the	
		surface making it harder to strip.			
		Obviously in addition to other stipper chemistries mechanical	
		issues such as sray pressures,nozzle type/configuration 
		chemical delivery systems(flood heads)etc. will influence	
		the strip rate.						
						Regards			
						Michael Barmuta		
						Staff Engineer		
						Fluke Corp.		
						Everett Wa.		
						(206)356-6076		 
	 
On Thu, 23 Jan 1997 15:13:12 -0800 [log in to unmask] wrote:

> From: [log in to unmask]> Date: Thu, 23 Jan 1997 15:13:12 -0800
> Subject: Re[2]: Stripping photo resist problem
> To: [log in to unmask]
> Cc: [log in to unmask]
> 
> 
> 
> Ted (and everyone else)
> 
> We are precleaning chemically and vacuum baking the substrate.  We coat 
with an 
> exit temperature equivelant to 140 F.  The panels are coated and printed in 
a 
> clean room held at 70 F and 45 to 50% RH.  We are using the mfg. suggested 
> exposure or slightly lower.  They are developed within the hour.  The 
entire 
> product cycle is only two days.  These panels are copper plated with only a 
few 
> microns of acid copper.
> 
> I have good results with other resists.  We have several part numbers which 
> require sub 2 mil features on half ounce copper.
> 
> I am hoping someone with experiance using this resist has suggestions or 
the 
> answer.
> 
> Thanks
> 
> Chuck
> ______________________________ Reply Separator 
_________________________________
> Subject: Re: Stripping photo resist problem
> Author:  [log in to unmask] at ccUnix
> Date:    1/23/97 2:47 PM
> 
> 
> [log in to unmask] wrote:
> > 
> > HI
> > 
> > I know that some of you out there are having excellant results using the 
> Morton
> > MX series photo resist for pattern plating.  I am experimenting with this
> > material and I to have resolved some remarkably small and difficult 
patterns. 
> > 
> > But I need some advise that the Morton rep's can't seem to give me.  How 
do 
> you
> > guys strip this stuff.  I use Alkastrip AQI in my stripper 
(Monoethanolamine) 
> at
> > 7% at 120 F. for the regular resist.  I have tried raising the 
concentration 
> to
> > 10% and the temperature up to 132 F. and there is still resist.  I tried 
5 % 
> > NaOH at 125 F., this improved the situation but there is still some 
residual 
> > resist on these panels.
> > 
> > I will appreciate any thoughts.  Thanks in advance. 
> > 
> > Chuck Brummer
> > Acuson
> > (818) 734-4930
> > [log in to unmask]
> Dear Chuck:
> 
> Not sure if I can help regarding the specific dry film you are using, 
> but what is your cleaning process prior to resist lam?  Do you have any 
> problems developing this film?  Lastly, what environment is the resist 
> exposed to after developing prior to resist stripping?
> 
> Ted Stern
> 
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