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   TO:         I4235700 IBMMAIL   new address for ipc technet 25.6.96

   FROM:       DSTEWART EX2       D.Stewart        - Product Development Manager.

   DATE:       22 January 1997
   SUBJECT:    RAW CARD MFG PROCESS

    Check the electroplated copper thickness in the through holes.
    As the carbon has a lower conductivity than copper, if it is plated
    under normal cycle conditions, it takes time to bridge the hole
    with copper. If your supplier does not wish to increase his plating
    time in the acid copper bath, you may find less copper in the hole
    than expected or specified. He may do a strike plate after
    Blackhole, similar to the low build/strike process, in which case
    it will look the same as electroless.


    The views expressed are my own and may not reflect those of my
    employer

    Dougal

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