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January 1997

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Subject:
Depanelising Ceramic Substrate
From:
aposeiko <[log in to unmask]>
Date:
Fri, 17 Jan 1997 15:00:01 -0800
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I am looking for a solution to break up ceramic substrates.  The 
conventional cutting/routing tools may not work well due to possibility 
of micro-cracks.  I have heard that some vendor has developed some kind 
of rollers (air inflated) that naturally breaks the substrates when 
passing the substrates through.   

Will appreciate any advice.

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