Bill has a great point! I would like to expand on it a bit........

The optimal process utilizes material properties to calibrate the profiling 
system. If you use the solder alloy which you are reflowing to secure the T/C to 
a particular pad, there will be a flat spot (transition temperature) in your 
profile. Then secure the T/C down in another area with epoxy. Chip bonder works 
great. This may alter your actual temperature ever so slightly. 

PS - it did clear as well as confuse ISO auditors who could not understand 
properties of materials!

Enjoy the tip,
Allen

_______________________________________________________________________________

Subject: Re: ASSY: thermocouple adhesive

From:    [log in to unmask] at ftl03

Date:    1/10/97  1:04 PM



Why not use solder its better !

Bob Willis
Process Engineering Consultant
Electronic Presentation Services
2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
Tel: (44) 01245 351502
Fax: (44) 01245 496123
Home Page: http://ourworld.compuserve.com/homepages/Bwillis
Email: [log in to unmask]


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