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Date: | Thu, 16 Jan 97 13:02:58 cst |
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Hi Phil -
Let me ask this question: When you do put adhesive on a MELF for wave
soldering purposes, do you have an failures? I would put forth that if
you have sufficient documentation showing that your procedure results
in no reduction of reliability for the use environment the assembly is
going in then ignore the "specification". Specifications are not
(well, should not be anyway) set in concrete - JSTD 001 is an example
of a specification that allows for processes to be fit to their use
environments. I wouldn't get wrapped up in the specifications words if
you can show proof that a process/assembly method is reliable.
Hopefully your customer will look at the situation the same way. Good
luck.
Dave Hillman
Rockwell Collins
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: melf's
Author: [log in to unmask] at ccmgw1
Date: 1/16/97 9:23 AM
Technetters
I have a customer who asks?
How can you apply adhesive to MELF's that will be wave soldered,
when section 2.4.2 of IPC-610 states that "Adhesive contacts an
unsleeved glass body component." is a nonconforming defect.
I say that there is a difference.
Adhesives used to bond a component in section 2 is for mechanical
holddown and the component could crack if it were applied to the
glass body.
Adhesive used for staking in section 10 has very little strength and
used only to hold the part until it is soldered.
anyway thats my story and I'm sticking to it.
Phil Belliveau
Sippican, inc.
7 Barnabas Rd
Marion, MA 02738
TEL: 508-748-1160 x379
FAX: 508-748-3086
EMAIL: [log in to unmask]
HOME PAGE : HTTP//WWW.SIPPICAN.COM
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