Hi Phil - Let me ask this question: When you do put adhesive on a MELF for wave soldering purposes, do you have an failures? I would put forth that if you have sufficient documentation showing that your procedure results in no reduction of reliability for the use environment the assembly is going in then ignore the "specification". Specifications are not (well, should not be anyway) set in concrete - JSTD 001 is an example of a specification that allows for processes to be fit to their use environments. I wouldn't get wrapped up in the specifications words if you can show proof that a process/assembly method is reliable. Hopefully your customer will look at the situation the same way. Good luck. Dave Hillman Rockwell Collins [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: melf's Author: [log in to unmask] at ccmgw1 Date: 1/16/97 9:23 AM Technetters I have a customer who asks? How can you apply adhesive to MELF's that will be wave soldered, when section 2.4.2 of IPC-610 states that "Adhesive contacts an unsleeved glass body component." is a nonconforming defect. I say that there is a difference. Adhesives used to bond a component in section 2 is for mechanical holddown and the component could crack if it were applied to the glass body. Adhesive used for staking in section 10 has very little strength and used only to hold the part until it is soldered. anyway thats my story and I'm sticking to it. Phil Belliveau Sippican, inc. 7 Barnabas Rd Marion, MA 02738 TEL: 508-748-1160 x379 FAX: 508-748-3086 EMAIL: [log in to unmask] HOME PAGE : HTTP//WWW.SIPPICAN.COM *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************