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1996

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Wed, 18 Dec 1996 16:13:08 -0500
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The previous comment are all well taken. The comment by Dougal Stewart on
wave soldering needs to be extended to reflow soldering as well. You need to
set your profile for a higher peak temperature/longer dwell to transfer
sufficient heat to form the Ni/Sn intermetallic layer.

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 201-543-2747
E-mail: [log in to unmask]

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