There is a new rigid board spec issued by IPC.  The new Specification is
IPC-6012 which is a replacement for IPC-RB-276.  There is also an
accompanying generic spec. IPC-6011 which covers some of the qualification,
dimensioning, SPC etc which was originally in IPC-RB-276.  There is to be an
article written by Bob Neves ( Microtech Labs) in his monthly article
(January, I think) in Circuit Tree which explains the new specifcation and
also its relation to the generic spec.  The other specs which are following
that will use the IPC-6011 generic spec are the Flex Spec, PCMCIA  spec. and
the MCM spec.  The number are IPC-6013, 6014 and 6015

The new rigid board spec (IPC-6012) has some new ideas on testing and
 acceptance criteria, but does not cover acceptance criteria for such things
as landless holes, vias in SMT and BGA lands, filled blind vias, blind via
interconnects etc., reinforcementless layers for blind vias and photoimagable
dielectric that remains in the board.  Would like some input as to whether
the above should be included in the rigid, flex, PCMCIA and MCM specs. or
shoud these be broken out into a separate spec(s) that addresses these
technologies only.

Phil Hinton 
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