Hai  to Experts on SMT process,

I am looking for whether a standard exists for selection of stencil 
thickness. I have been told by my stencil manuf that the apertures are 
shrunk down from pad size (Gerber data) and stencil thickness is taken based 
on the industrial norm based on other users of stencils. It look to me 
rather trivial. Though ind norms may work for most of the boards but they 
may not work for few different boards---thus, there must be norm on min and 
max amount of solder /solder paste.
I am looking for norms on the solder volume which can be used for selection/ 
verifying the stencil apertures and thickness.

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