Bill,

If your FCT (Functional Card Testing) testing your invidual 
SIMMS/DIMMS thats great, but a ineffective and costly process.  In designing 
SIMM/DIMM array profiles at my last employer, we concluded bed of nails testing 
(ATE) was more efficient.  You may want to consider duing the same.  
Run the Array of SIMMs/DIMMs through your standard assembly process 
and disassemble the arrays in the end (provided you have scoring 
between modules and paasive/active components are kept to a distance 
from the scored edge).  If you need, call me and I will do my best to 
give some insight to the above, I hope.

John Gulley 
Compuroute Inc.
Dallas, TX.


> From:          "Barthel, Bill" <[log in to unmask]>
> To:            "'TechNet'" <[log in to unmask]>
> Subject:       ASSY: Simm Board Handling
> Date:          Sat, 21 Sep 96 08:47:00 CDT

> 
> We are new to SIMM assembly and are looking for suppliers of equipment for 
> singulation after assembly and automated handling for test.  Any 
> suggestions?
> 
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