Bill, If your FCT (Functional Card Testing) testing your invidual SIMMS/DIMMS thats great, but a ineffective and costly process. In designing SIMM/DIMM array profiles at my last employer, we concluded bed of nails testing (ATE) was more efficient. You may want to consider duing the same. Run the Array of SIMMs/DIMMs through your standard assembly process and disassemble the arrays in the end (provided you have scoring between modules and paasive/active components are kept to a distance from the scored edge). If you need, call me and I will do my best to give some insight to the above, I hope. John Gulley Compuroute Inc. Dallas, TX. > From: "Barthel, Bill" <[log in to unmask]> > To: "'TechNet'" <[log in to unmask]> > Subject: ASSY: Simm Board Handling > Date: Sat, 21 Sep 96 08:47:00 CDT > > We are new to SIMM assembly and are looking for suppliers of equipment for > singulation after assembly and automated handling for test. Any > suggestions? > > *************************************************************************** > * TechNet mail list is provided as a service by IPC using SmartList v3.05 * > *************************************************************************** > * To unsubscribe from this list at any time, send a message to: * > * [log in to unmask] with <subject: unsubscribe> and no text. * > *************************************************************************** > > *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************