Subject: | |
From: | |
Date: | Sun, 22 Sep 1996 14:55:55 +600 CDT |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Bill,
If your FCT (Functional Card Testing) testing your invidual
SIMMS/DIMMS thats great, but a ineffective and costly process. In designing
SIMM/DIMM array profiles at my last employer, we concluded bed of nails testing
(ATE) was more efficient. You may want to consider duing the same.
Run the Array of SIMMs/DIMMs through your standard assembly process
and disassemble the arrays in the end (provided you have scoring
between modules and paasive/active components are kept to a distance
from the scored edge). If you need, call me and I will do my best to
give some insight to the above, I hope.
John Gulley
Compuroute Inc.
Dallas, TX.
> From: "Barthel, Bill" <[log in to unmask]>
> To: "'TechNet'" <[log in to unmask]>
> Subject: ASSY: Simm Board Handling
> Date: Sat, 21 Sep 96 08:47:00 CDT
>
> We are new to SIMM assembly and are looking for suppliers of equipment for
> singulation after assembly and automated handling for test. Any
> suggestions?
>
> ***************************************************************************
> * TechNet mail list is provided as a service by IPC using SmartList v3.05 *
> ***************************************************************************
> * To unsubscribe from this list at any time, send a message to: *
> * [log in to unmask] with <subject: unsubscribe> and no text. *
> ***************************************************************************
>
>
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|