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Date: | Fri, 26 Jul 1996 08:51:03 -0400 |
Content-Type: | text/plain |
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We are a Contract Manufacturer and consequently see many
varieties of Printed Circuit Board assemblies. We have Tech Devices
Wave and Aqueous machines.
I would like to see if I can obtain/purchase any documented
guidelines for solving various process problems for the wave
soldering/cleaning processes. The more practical approach versus
the theoretical approach is most desired.
EMail: [log in to unmask]
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