Subject: | |
From: | |
Date: | Thu, 1 Feb 96 10:03:33 PST |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Being an Application Engineer supporting Flex and
Rigid-flex product for Merix Corporation, I always
get nervous when comments are made regarding things
that "cannot be done" on flex circuitry.
At Merix, one of our largest flex circuit programs
uses the Entek 106A process. This flex application,
as well as others that have used the Entek OSP surface
finish, have proven to be very compatible with our customers
assembly processes and flex assembly processes at Merix.
Furthermore, the process for applying the Entek
OSP surface finish is extremely compatible with
flex circuit processing. Especially if you are comparing
it to the mechanical and thermal stresses inherent to other
surface finish application processes (ie: HASL).
I do not want to suggest that the Entek system will work in
every application. If I knew of such a system, Merix wouldn't
need Applications Engineers like me.
If you have specific questions about using Entek
surface finishes on flex circuits, feel free
to contact me at Merix Corp:
[log in to unmask]
I would be happy to discuss the compatibility of our
Entek 106A with your assembly processes.
If you have generic questions around Entek,
N/C process compatibility, etc. I would suggest
that you contact Enthone directly. A name you can
start with is:
Bret Taucher
Enthone
206/222-6629
Thank for you time,
Jon Woodyard, Applications Engineer
Merix Corporation
503/359-2623
[log in to unmask]
---------Original Message---------------------------------------
| _________________________________
| Subject: Re: REQ: Info on Entek Plus/NC Flux
| Author: [log in to unmask] at corp
| Date: 1/31/96 7:58 PM
|
|
| I worked for a flex manufacture that was trying to get Entek
| approved. It's
| almost imposible with flex. I don't recommend it. Be sure
| your spec. is
| clear about ridgid only.
|
|
|
|
|