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Date: | Tue, 17 Dec 1996 05:45:46 +0800 |
Content-Type: | text/plain |
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Hello everyone:
Thank first for your help!
About the open/short defects in fine line PCB manufacturing,I
introduce more details about our fine line manufacturing process(our
process is the print-plate-and-etch):
1. The resist we used is the Hitachi HF-240 dry film and the
surface preparation prior to DF is mechanical scrub.We use
the non-collimated light source, and the DF lamination
speed is more slow than normal.
2. The stripper is NaOH solution.The concentration of the NaOH
solution is 3%.
3. We found many short defects and some open defects at AOI
after etching. The short defects between
traces is very fine.
In my opinion, the short defects is due to:
a.poor adhesion between the surface and DF
b.there are residues after developing
c.there are residues after preclean during plating
d.there are residues after stripping
But I havn't got good method to evaluate and improve above
things,
can you help me? Thank you very much!
Best regards!
our email is:[log in to unmask]
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