Hello everyone: Thank first for your help! About the open/short defects in fine line PCB manufacturing,I introduce more details about our fine line manufacturing process(our process is the print-plate-and-etch): 1. The resist we used is the Hitachi HF-240 dry film and the surface preparation prior to DF is mechanical scrub.We use the non-collimated light source, and the DF lamination speed is more slow than normal. 2. The stripper is NaOH solution.The concentration of the NaOH solution is 3%. 3. We found many short defects and some open defects at AOI after etching. The short defects between traces is very fine. In my opinion, the short defects is due to: a.poor adhesion between the surface and DF b.there are residues after developing c.there are residues after preclean during plating d.there are residues after stripping But I havn't got good method to evaluate and improve above things, can you help me? Thank you very much! Best regards! our email is:[log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************