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Date: | Thu, 10 Oct 96 11:39:26 EST |
Content-Type: | text/plain |
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Those of you using a no-clean/low-residue soldering solution
in your manufacturing operations, I have some questions
concerning flux compatibility.
What problems have you encountered between no-clean paste,
liquid flux at wave solder and benchtop soldering no-clean
flux(hand soldering)? I am strongly considering a water
based no-clean for wave solder to try to reduce VOCs
contribution at this facility. Will this direction limit
the flexibility of the SMD area to choose their no-clean
paste, or, perhaps the hand soldering side be limited in
their flux selection? I would appreciate some feedback and
thanks in advance.
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