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Forwarded to TechNet for Assistance
Thanks
Dave Bergman, IPC
---------- Forwarded message ----------
Date: Tue, 09 Apr 1996 13:36:48 +0100 (MET)
From: EDDIE VAN HOREN 014 57 20 08 <[log in to unmask]>
To: [log in to unmask]
Subject: SOIC'S IN WAVESOLDERING
David,
I'm looking for help somewhere in the industry on a serious soldering
problem.
Is there something like a bulletin board where items can be posted for
discussion?
Today's problem in a nutshell :
Subject : wavesoldering of SO-components (mainly SOIC).
Since a few years, Texas Instruments has changed the lead finish of the
SOIC's to a layer of nickel with a palladium flash (simplified).
This can result in 1000 ppm open solder joints when wave soldering.
In the very near future, starting next june, Motorola is also switching
to a simular leadfinish. All others are expected to follow soon.
In the farther future, useing other PCB finishes than SnPb ( NiAu,
preservated Cu etc.) will undoubtedly increase the problem.
I see this as a tremendous problem for those people who are
wavesoldering this kind of components.
Is there a way to find out whether this problem is recognized by users,
and if somebody sees a solution to the problem ?
And again, is there a way to put questions to the IPC community?
Best regards.
Eddie
Eddie Van Horen
Industrial Engineer
Alcatel Telecom Belgium
Bell Telephonelaan 2
2440 Geel
Belgium
Tel (32) 14 57 20 08
Fax (32) 3 240 48 02
E-mail : [log in to unmask]
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