Forwarded to TechNet for Assistance Thanks Dave Bergman, IPC ---------- Forwarded message ---------- Date: Tue, 09 Apr 1996 13:36:48 +0100 (MET) From: EDDIE VAN HOREN 014 57 20 08 <[log in to unmask]> To: [log in to unmask] Subject: SOIC'S IN WAVESOLDERING David, I'm looking for help somewhere in the industry on a serious soldering problem. Is there something like a bulletin board where items can be posted for discussion? Today's problem in a nutshell : Subject : wavesoldering of SO-components (mainly SOIC). Since a few years, Texas Instruments has changed the lead finish of the SOIC's to a layer of nickel with a palladium flash (simplified). This can result in 1000 ppm open solder joints when wave soldering. In the very near future, starting next june, Motorola is also switching to a simular leadfinish. All others are expected to follow soon. In the farther future, useing other PCB finishes than SnPb ( NiAu, preservated Cu etc.) will undoubtedly increase the problem. I see this as a tremendous problem for those people who are wavesoldering this kind of components. Is there a way to find out whether this problem is recognized by users, and if somebody sees a solution to the problem ? And again, is there a way to put questions to the IPC community? Best regards. Eddie Eddie Van Horen Industrial Engineer Alcatel Telecom Belgium Bell Telephonelaan 2 2440 Geel Belgium Tel (32) 14 57 20 08 Fax (32) 3 240 48 02 E-mail : [log in to unmask]