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| From [log in to unmask] Tue Feb 27 08: |
52:03 1996 |
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<Pine.3.89.9602261712.B31010-0100000@ipc> |
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IPC-6012, Qualification and Performance Specification for Rigid Printed
Boards, identifies the following minimums:
Class 1 Class 2 Class 3
Nickel to act as a
barrier for copper-tin 1.0 um 1.3 um 1.3 um
compounds
Gold for edge-board
connectors and areas not 0.8 um 0.8 um 1.3 um
to be soldered
um = micrometers
It should be noted that this document is in proposal stage. These numbers
are subject to revision during the development of the document. This
document is to replace IPC-RB-276.
****************************************
Lisa M. Williams
Technical Staff
IPC
2215 Sanders Road
Northbrook, IL 60062
phone: (847) 509-9700 x 379
fax: (847) 509-9798
email: [log in to unmask]
****************************************
On Mon, 26 Feb 1996 [log in to unmask] wrote:
> A question,
>
> Are there any reports or IPC data which details the minimum amounts of
> electroless nickel needed to provide a sufficient barrier to copper migration
> and the minimum amounts immersion gold needed to provide sufficient plating
> finish.
>
> Concerns are solderability failures and corrosion of components.
>
> Annmarie Rainford
> Merix Corporation
> Forest Grove, Oregon 97116
> 503-359-9300 x74426
>
>
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