IPC-6012, Qualification and Performance Specification for Rigid Printed Boards, identifies the following minimums: Class 1 Class 2 Class 3 Nickel to act as a barrier for copper-tin 1.0 um 1.3 um 1.3 um compounds Gold for edge-board connectors and areas not 0.8 um 0.8 um 1.3 um to be soldered um = micrometers It should be noted that this document is in proposal stage. These numbers are subject to revision during the development of the document. This document is to replace IPC-RB-276. **************************************** Lisa M. Williams Technical Staff IPC 2215 Sanders Road Northbrook, IL 60062 phone: (847) 509-9700 x 379 fax: (847) 509-9798 email: [log in to unmask] **************************************** On Mon, 26 Feb 1996 [log in to unmask] wrote: > A question, > > Are there any reports or IPC data which details the minimum amounts of > electroless nickel needed to provide a sufficient barrier to copper migration > and the minimum amounts immersion gold needed to provide sufficient plating > finish. > > Concerns are solderability failures and corrosion of components. > > Annmarie Rainford > Merix Corporation > Forest Grove, Oregon 97116 > 503-359-9300 x74426 > >