Hello everyone:
    Thank first for your help!     
    About the open/short defects in fine line PCB manufacturing,I 
introduce more details about our fine line manufacturing process(our
process is the print-plate-and-etch):
       1. The resist we used is the Hitachi HF-240 dry film and the
          surface preparation prior to DF is mechanical scrub.We use
          the non-collimated light source, and the DF lamination       
          speed is more slow than normal.
       2. The stripper is NaOH solution.The concentration of the NaOH
          solution is 3%.
       3. We found many short defects and some open defects at AOI         
                                after etching. The short defects between
traces is very                         fine.

     In my opinion, the short defects is due to:
       a.poor adhesion between the surface and DF
       b.there are residues after developing
       c.there are residues after preclean during plating
       d.there are residues after stripping
     But I havn't got good method to evaluate  and improve      above 
things,
     can you help me? Thank you very much!


      Best regards!
our email is:[log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************