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id m0vX5kG-0000QBC; Mon, 9 Dec 96 07:27 CST |
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| From [log in to unmask] Mon Dec 9 11: |
47:15 1996 |
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My company is looking to design a multilayer PCB with blind vias. Another
company will do the actual fab. I've heard there's more than one way to
do blind vias: either controlled depth drilling or fabbing and drilling
two halves of a board separately and sticking them together. Does anyone
have any experience with either of these methods, and is there another
way I don't know of? Which way is better, what are the risks, etc? Any
info would be appreciated. Thanks,
Andy Buonviri
Ixthos, Inc.
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