Mime-Version: |
1.0 |
Content-Type: |
text/plain; charset="us-ascii" |
Old-Return-Path: |
|
Date: |
Thu, 14 Nov 1996 20:07:23 -0500 (EST) |
Precedence: |
list |
From [log in to unmask] Fri Nov 15 10: |
40:01 1996 |
Resent-Sender: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
X-Sender: |
|
TO: |
|
Return-Path: |
<TechNet-request> |
X-Loop: |
|
Resent-Message-ID: |
<"aNs0c1.0.1SG._4yYo"@ipc> |
Subject: |
|
From: |
|
Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0vOCgK-0000SKC; Thu, 14 Nov 96 19:02 CST |
Resent-From: |
|
X-Mailer: |
Windows Eudora Version 1.4.4 |
Message-Id: |
|
Parts/Attachments: |
|
|
Dear Technetters:
Recently, a customer inquired as to what design considerations should be
applied in order to prevent post assembly SMD pad solder 'cracks' during
depanelization of V-groove (aka scored) pwb arrays.
As a self confessed 'non-expert' on SMD design and assembly concerns, I
would appreciate any feedback regarding this design issue, such as:
design rules currently applied
SMD component(s) to avoid in scored arrays
Minimum distance from scored edge to SMD pad
single/double sided SMD issues
component orientation with respect to scored edge
Minimum/maximum array area size
Minimum/maximum pwb array thickness
Maximum scored web thickness
preferred methods for depanelization
Perhaps there are interactions between the list provided above. I also
realize that this list is probably not comprehensive and would welcome
additional concerns that I may not be cognizant of.
Thanks in advance to all of those who reply....
regards
Dave Rooke
Circo Craft - Pointe Claire
([log in to unmask])
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|