 
| Mime-Version: |
1.0 |
| Content-Type: |
text/plain; charset=US-ASCII |
| Old-Return-Path: |
|
| Date: |
25 Oct 96 10:55:06 PDT |
| Precedence: |
list |
| Resent-From: |
|
| Cc: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| X-Loop: |
|
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0vGqct-0000RLC; Fri, 25 Oct 96 13:04 CDT |
| X-Nvlenv-01Date-Posted: |
25-Oct-1996 11:03:31 -0700; at NGM1.Trimble |
| Resent-Message-ID: |
<"EA0-s3.0._nJ.25GSo"@ipc> |
| Subject: |
|
| From: |
|
| References: |
<61E9E439028DD9D1@-SMF-> |
| Message-Id: |
<61E9E439018DD9D1@-SMF-> |
| Resent-Sender: |
|
| From [log in to unmask] Mon Oct 28 09: |
05:57 1996 |
| Parts/Attachments: |
|
|
It has been our procedure to bake flex circuits (Kapton) for 2 hours at
100 degrees C. prior to assembly and solder reflow in order to drive off
any entrained moisture.
A question has come up as to what is the recommended length of time the
parts can remain in the asssembly environment prior to a re-bake being
necessary.
We would appreciate hearing what the conventional wisdom is from you
TechNetters.
Regards
Sherman Banks
[log in to unmask]
408/481-6047
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
