TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0vDaU3-0000QuC; Wed, 16 Oct 96 13:14 CDT
Encoding:
10 TEXT
Old-Return-Path:
Date:
Wed, 16 Oct 96 13:03:00 DST
From [log in to unmask] Wed Oct 16 14:
41:44 1996
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/6930
TO:
Return-Path:
<TechNet-request>
Resent-Message-ID:
<"_39AF3.0.Gq4.sNIPo"@ipc>
Subject:
From:
"Baldwin, Jeff A" <[log in to unmask]>
X-Loop:
X-Mailer:
Microsoft Mail V3.0
Message-ID:
Parts/Attachments:
text/plain (20 lines)

Hello.  We are looking at depaneling techniques for PC Cards.  We will 
probably be using a 3 board side-by-side design, and using pallets to help 
control warpage and handling issues.  Could anyone suggest an adequate score 
depth for an average 0.020" thick PCB?  If we were to use perforated tabs, 
could anyone suggest a hole size and spacing pattern?  Thank you for your 
help.

Jeff Baldwin
[log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2