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From [log in to unmask] Wed Sep 18 16: |
33:56 1996 |
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Phil: The Tin Research Institute published the "Photographic
Guide to Soldering Quality" back in the late 70's or
early 80's.This contained a reference to pumice
abrasive cleaners and dewetting.
The Spiliotis article from '78 as mentioned in an
earlier post also discusses dewetting related to
pumice clean.
In a nutshell the pumice becomes embedded in the
surface of the copper which results in poor solder
wetting during subsequent processing.I believe when
this work was done it related to electroplated Sn/Pb
and not HAL.
I have copies of both articles although they're getting
pretty crumbly.
Regards
Michael Barmuta
Staff Engineer
Fluke Corp.
Everett Wa.
(206)356-6076
On Wed, 18 Sep 1996 07:53:20 -0700 [log in to unmask] wrote:
> From: [log in to unmask]> Date: Wed, 18 Sep 1996 07:53:20 -0700
> Subject: Dewetting & Pumice Scrub
> To: [log in to unmask]
>
> Technetters
>
> In the mid 1970's Paul Davis of Tin Research wrote an article on dewetting
as
> result of pumice scrub. Does anyone have a reference to where this was
> published. Also does anyone have any input as to dewetting as result of
> pumice scrub in relation to a sequence of: (1) pumice scrub, (2)apply
solder
> mask, (3) hot air level, (4)solderability test and dewet..
>
> Another question on dewetting. Has anybody seen dewetting as a result of a
> white residue on the lands and board which was analyzed as lead carbonate?
> And another:where does the lead carbonate come ?
>
> Phil Hinton
> Hinton PWB Engineering
> [log in to unmask]
>
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