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| From [log in to unmask] Fri Sep 13 10: |
11:20 1996 |
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Wed, 11 Sep 1996 17:42:26 -0400 |
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WHAT YOU DESCRIBE WE WOULD CALL "DRY PACKING".
IT IS A COMMON PRACTICE FOR THOSE SMT COMPONENTS WHICH HAVE CERTAIN
CRITICAL DESIGN VALUES SUCH AS PACKAGE SIZE, DIE SIZE, PACKAGE
THICKNESS, ETC.
IF YOU RECHECK I THINK YOU WILL FIND THE BAKE TEMP. IS 125 DEGC. NOT
DEGF.
______________________________ Reply Separator _________________________________
Subject: Handling of SMT components
Author: [log in to unmask] at smtp
Date: 9/11/96 02:22 PM
We recently received some SMT components in vaccuum sealed packaging, which
included dessiccant packets, with warnings about exposure to moisture. If
the ICs were to be stored above 68% RH or if the bag was opened, the parts
were to be used within 2 or 7 days. If they were not used within that time
period they have to go thru a 24 hour cure at 125F. These are fairly simple
J lead and gull wing packs ( one of them is an LGA), but we have not seen
this warning on other SMT ICs. Is this fairly standard? Tom Moore
Tom Moore
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