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| From [log in to unmask] Wed Feb 7 17: |
05:10 1996 |
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<Text_1>
Simple question, but we can't seem to find the answer:
What is the % elongation to failure for solder plate?
We have an application where a single sided flex circuit is being
folded back on itself at .0005" radius (not recommended). The outer
surface is solder plated.
The copper (RA) is experiencing 11.9% max. strain and the solder plate
sees 17.4%. Both the copper trace and the solder plate are cracked.
It's not clear if the crack started in just one of the metals, and
progressed into the other.
We'd like to suggest opening up the bend radius to provide a reduced
strain, but we need to know the max % elongation of the solder plate
to know how far.
Andy Magee - Applications Engineer
Rogers Corp - Circuit Materials Unit
Tel: (602) 917-5237
Fax: (602) 917-5256
E-Mail: [log in to unmask]
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