<Text_1> Simple question, but we can't seem to find the answer: What is the % elongation to failure for solder plate? We have an application where a single sided flex circuit is being folded back on itself at .0005" radius (not recommended). The outer surface is solder plated. The copper (RA) is experiencing 11.9% max. strain and the solder plate sees 17.4%. Both the copper trace and the solder plate are cracked. It's not clear if the crack started in just one of the metals, and progressed into the other. We'd like to suggest opening up the bend radius to provide a reduced strain, but we need to know the max % elongation of the solder plate to know how far. Andy Magee - Applications Engineer Rogers Corp - Circuit Materials Unit Tel: (602) 917-5237 Fax: (602) 917-5256 E-Mail: [log in to unmask]