 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uouXa-0000MeC; Fri, 9 Aug 96 11:36 CDT |
| Content-Type: |
text/plain; charset=ISO-8859-1 |
| Old-Return-Path: |
|
| Date: |
Fri, 9 Aug 1996 10:23:53 -0500 |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| MIME-Version: |
1.0 |
| Status: |
O |
| X-Mailing-List: |
|
| X-MSMail-Priority: |
Normal |
| Return-Path: |
<TechNet-request> |
| X-Status: |
|
| X-Loop: |
|
| TO: |
|
| From [log in to unmask] Fri Aug 9 12: |
15:22 1996 |
| Resent-Message-ID: |
<"KO0551.0.yu2.nZs2o"@ipc> |
| Subject: |
|
| From: |
|
| Content-Transfer-Encoding: |
7bit |
| X-Priority: |
3 |
| X-Mailer: |
Microsoft Internet Mail 4.70.1132 |
| Message-Id: |
|
| Parts/Attachments: |
|
|
We are attempting to switch our pre-clean process prior to soldermask from
chem-clean followed by a mechanical scrub to chem-clean only. We have
experienced problems with poor soldermask adhesion at the nickel/gold tab
area. We are using a reverse current tin/lead strip prior to nickel/gold
and the HCL seems to be getting under the mask causing it to peel. Has
anyone else had experience with a chem-clean process prior to soldermask
and reverse current plate prior to nickel/gold.
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
