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| From [log in to unmask] Sun Aug 4 14: |
25:56 1996 |
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I'd probably get a response if I included my email address, so here it
is:
[log in to unmask]
______________________________ Forward Header __________________________________
Subject: ASSY: Whiskers on QFP's After Reflow
Author: Greg Kilinski at BLDG-C
Date: 8/1/96 08:06 AM
My subcontract assembler is experiencing whisker formation after
(convection) reflow soldering on 208 QFP packages. Eutectic solder
paste is used. I haven't performed XRF on the package nor the PCB,
but I suspect high Sn content. Any comments would be greatly
appreciated.
Greg Kilinski
Acuson Corp.
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