TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0tZCkN-0000O0C; Mon, 8 Jan 96 02:16 CST
Old-Return-Path:
Date:
08 Jan 96 03:18:35 EST
Precedence:
list
X-Loop:
Resent-Sender:
X-Status:
Status:
RO
X-Mailing-List:
<[log in to unmask]> archive/latest/2168
From [log in to unmask] Mon Jan 8 15:
36:22 1996
TO:
Return-Path:
Resent-Message-ID:
<"A3ZpS1.0.bTA.0BDym"@ipc>
Subject:
From:
Robert Willis <[log in to unmask]>
Message-ID:
Resent-From:
Parts/Attachments:
text/plain (16 lines)

I am currently evaluating connectors for PC card application as well as looking
at general problems during assembly of thin cards. I would appreciate any
information that engineers may be able to provide to assist my project.
My concerns are placement and vision alignment of connectors, any special design
rules, connector packaging, reflow support, connector rework etc.

Bob Willis
SMART Group
2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
Tel: (44) 01245 351502
Fax: (44) 01245 496123
Home Page: http:// Still Not Available



ATOM RSS1 RSS2